Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322714 | Heterogeneous integration of radio frequency transistor chiplets having interconnection tuning circuits | James F. Buckwalter, Michael D. Hodge, Justin Kim, Florian G. Herrault | 2025-06-03 |
| 12261091 | Chip integration into cavities of a host wafer using lateral dielectric material bonding | Florian G. Herrault, Isaac Rivera, James F. Buckwalter | 2025-03-25 |
| 12191295 | Heterogeneous integration of radio frequency transistor chiplets having interconnections to host wafer circuits for optimizing operating conditions | James F. Buckwalter, Florian G. Herrault, Justin Kim, Michael D. Hodge | 2025-01-07 |