Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12266608 | Integrated photonics and processor package with redistribution layer and EMIB connector | Susheel Jadhav, Kenneth M. Brown, David Chak Wang Hui, Ling Liao | 2025-04-01 |