LY

Lohit Yerva

IN Intel: 1 patents #1,527 of 3,896Top 40%
Overall (2025): #302,429 of 469,880Top 65%
1
Patents 2025

Issued Patents 2025

Patent #TitleCo-InventorsDate
12347818 Logic die in a multi-chip package having a configurable physical interface to on-package memory Narasimha Lanka, Mohammad Mamunur Rashid, Kuljit S. Bains 2025-07-01