Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394713 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon | 2025-08-19 |
| 12328125 | Device, method and system to determine calibration information with a shared ring oscillator circuit | — | 2025-06-10 |