Issued Patents 2025
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12205902 | High-density interconnects for integrated circuit packages | Veronica Strong, Aleksandar Aleksov, Henning Braunisch, Johanna M. Swan, Shawna M. Liff | 2025-01-21 |