Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424454 | Composite layer circuit element | Chuan-Ming Yeh, Kuo-Jung Fan, Cheng-Chi Wang | 2025-09-23 |
| 12322686 | Redistribution layer structure | Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Cheng-Chi Wang | 2025-06-03 |
| 12315741 | Method of manufacturing electronic device with reduced substrate warpage | Chuan-Ming Yeh, Sheng-Hui Chiu, Kuo-Jung Fan | 2025-05-27 |
| 12191197 | Manufacturing method of package structure of electronic device | Ching-Wei Chen, Yu-Jen Chang, Tzu-Yen Chiu, Hung-I Tseng, Chuan-Ming Yeh | 2025-01-07 |