Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417964 | Via-filling method of through-glass via substrate | Hsiao-Lu CHEN, Ai-Sen Liu, Hsiang-An FENG | 2025-09-16 |
| 12418011 | Bonding and transferring method for die package structures | Hsiao-Lu CHEN, Ai-Sen Liu, Hsiang-An FENG | 2025-09-16 |