Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424501 | Semiconductor package including a chip-substrate composite semiconductor device | Christian Fachmann, Barbara Angela Glanzer | 2025-09-23 |
| 12368052 | Chip-substrate composite semiconductor device | Christian Fachmann, Barbara Angela Glanzer | 2025-07-22 |
| 12349401 | Semiconductor device including a trench structure having a trench dielectric structure with a gap | Hans Weber, David Kammerlander | 2025-07-01 |