Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374661 | Power module having vertically aligned first and second substrates | Ewald Guenther, Thomas Schmid | 2025-07-29 |
| 12334458 | Package with pad having open notch | — | 2025-06-17 |
| 12300643 | Solder stop feature for electronic devices | Ivan Nikitin, Peter Scherl, Achim Althaus | 2025-05-13 |
| 12224222 | Semiconductor package having a thermally and electrically conductive spacer | Christian Neugirg, Peter Scherl, Ewald Guenther | 2025-02-11 |