Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412869 | Electronic structure having first and second thermal conductive materials covering conductive bumps and manufacturing method thereof, and electronic package having electronic structure and manufacturing method thereof | — | 2025-09-09 |
| 12354885 | Electronic package, electronic structure and manufacturing method thereof | Kuan-Wei Chuang | 2025-07-08 |