Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Sheng-Hsiang FU, Ching Ting Peng, Ho-Yin Yiu | 2025-09-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424567 | Chip package and manufacturing method thereof | Sheng-Hsiang FU, Ching Ting Peng, Ho-Yin Yiu | 2025-09-23 |