Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381116 | Method of manufacturing an interconnection structure for a semiconductor device having a spacer separating first and second conductive lines | Stefan Decoster | 2025-08-05 |
| 12237207 | Method for forming a buried metal line in a semiconductor substrate | Boon Teik Chan, Efrain Altamirano Sanchez, Anshul Gupta, Basoene Briggs | 2025-02-25 |