Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12382581 | Sidewall plating of circuit boards for layer transition connections | Yuan Yao | 2025-08-05 |
| 12300577 | Heterogeneous integrated multi-chip cooler module | Timothy J. Chainer, Joshua M. Rubin, Arvind Kumar | 2025-05-13 |
| 12262514 | Heat sinks with beyond-board fins | Shurong Tian, Joshua M. Rubin | 2025-03-25 |
| 12230436 | Spacer to reduce magnetic coupling | Yuan Yao, Xin Zhang, Andrew Ferencz, Shurong Tian | 2025-02-18 |