TH

Takashi Hisada

IBM: 2 patents #563 of 3,866Top 15%
📍 Zama, JP: #5 of 23 inventorsTop 25%
Overall (2025): #82,786 of 469,880Top 20%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12354983 Fine-pitch joining pad structure Toyohiro Aoki, Koki Nakamura 2025-07-08
12315775 Underfill vacuum process Toyohiro Aoki, Chinami Marushima, Risa Miyazawa, Akihiro Horibe 2025-05-27