Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199003 | Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure | Luke England, Huahung Kao, Ronen Sinai | 2025-01-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199003 | Packaging stacked substrates and an integrated circuit die using a lid and a stiffening structure | Luke England, Huahung Kao, Ronen Sinai | 2025-01-14 |