Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213248 | Printed wiring board | Shigeto Iyoda | 2025-01-28 |
| 12189193 | Semiconductor package | Keisuke Shimizu | 2025-01-07 |
| 12193156 | Wiring substrate and method for manufacturing wiring substrate | Kentaro WADA | 2025-01-07 |