Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288761 | Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same | Jun Yong Song, Kang Hun KIM | 2025-04-29 |
| 12237251 | Semiconductor package including connection pad including groove pattern | Kang Hun KIM, Jun Yong Song | 2025-02-25 |