Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322731 | Semiconductor package using a coreless signal distribution structure | Do Hyung Kim, Seung Chul Han | 2025-06-03 |
| 12315845 | Electronic device having a substrate-to-substrate interconnection structure and manufacturing method thereof | Joon Young Park, Ji Hye Yoon | 2025-05-27 |