Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341116 | Chip package structure, preparation method, and electronic device | Xiaoyun WEI, Yong Yang | 2025-06-24 |
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Chaojun Deng
Overall (2025): #429,025 of 469,880Top 95%
1
Patents 2025