Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12258468 | Thermosetting resin composition, prepreg, resin-coated metal foil, laminate, printed wiring board, and semiconductor package | Yuya HIRAYAMA, Keisuke Kushida, Hiroshi Shimizu | 2025-03-25 |