Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344739 | Conductive epoxy resin composition for copper bonding | Yang Ti, Qili Wu, Jiawen Zhao | 2025-07-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344739 | Conductive epoxy resin composition for copper bonding | Yang Ti, Qili Wu, Jiawen Zhao | 2025-07-01 |