Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
HF

Hidemichi Fujiwara

FC Furukawa Electric Co.: 1 patents #50 of 153Top 35%
Overall (2025): #370,126 of 469,880Top 80%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12374646 Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body Norzafriza NITTA, Yoshihiro Sato 2025-07-29