Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414240 | Circuit forming method and circuit forming device | Hironori Kondo | 2025-09-09 |
| 12391812 | Fiber-dispersed resin composite material, molding, and composite member | Hidekazu Hara, Jae Kyung Kim, Jiro SAKATO, Jirou Hiroishi, Toshihiro Suzuki +3 more | 2025-08-19 |