BL

Boon Yew Low

NU Nxp Usa: 1 patents #45 of 236Top 20%
📍 Subang Jaya, MY: #1 of 2 inventorsTop 50%
Overall (2025): #438,867 of 469,880Top 95%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12415305 Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes Sheila F. Chopin, Nishant Lakhera 2025-09-16