Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12251897 | Method of preparing thick laminate wafers for wafer thermoforming and injection molding | Eric BEGG, Zbigniew Tokarski, Peiqi Jiang | 2025-03-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12251897 | Method of preparing thick laminate wafers for wafer thermoforming and injection molding | Eric BEGG, Zbigniew Tokarski, Peiqi Jiang | 2025-03-18 |