Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278117 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Chunggu Lee, Jungjin Lee | 2025-04-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12278117 | Underfill film for semiconductor package and method for manufacturing semiconductor package using the same | Taejin CHOI, Chunggu Lee, Jungjin Lee | 2025-04-15 |