Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417938 | Processing apparatus for integrating a semiconductor wafer and an annular frame through a tape | Takashi Mori, Yoshinori KAKINUMA, Jonghyun RYU, Mitsuru IKUSHIMA, Makoto Saito +2 more | 2025-09-16 |
| 12308262 | Processing apparatus | Yoshinori KAKINUMA | 2025-05-20 |
| 12308276 | Tape pressure bonding apparatus | Yoshinobu Saito, Yoshinori KAKINUMA | 2025-05-20 |
| 12208984 | Tape affixing apparatus | Yoshinobu Saito, Jonghyun RYU | 2025-01-28 |