Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12312512 | Adhesive sheet for backgrinding and production method for semiconductor wafer | Karl Heinz Priewasser, Tomoya Tsukui, Takeshi Saito | 2025-05-27 |
| 12243766 | Back grinding adhesive sheet, and method for manufacturing semiconductor wafer | Karl Heinz Priewasser, Tomoya Tsukui, Takeshi Saito | 2025-03-04 |