Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12408278 | Electronic module assembly structure | Kun Jiang, Jianxin Chen, Geguo Men | 2025-09-02 |
| 12389553 | Method for forming power module package, power module package and electronic device | Quansong Luo, Yanbing Xia, Yanggui Feng, Kaijian Yang, Liang Jin | 2025-08-12 |