Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
FF

Frank Fournel

CEA: 5 patents #2 of 592Top 1%
AA Ams Ag: 1 patents #3 of 28Top 15%
SO Soitec: 1 patents #19 of 52Top 40%
Overall (2025): #24,333 of 469,880Top 6%
5
Patents 2025

Issued Patents 2025

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
12424497 Method for transferring a layer from a source substrate to a destination substrate Julie Widiez 2025-09-23
12417942 Process for hydrophilically bonding substrates Vincent Larrey, Francois Rieutord, Jean-Michel Hartmann, Didier Landru, Oleg Kononchuk +1 more 2025-09-16
12412786 Method for transferring a layer from a source substrate to a destination substrate Julie Widiez 2025-09-09
12322717 Semiconductor device and method for manufacturing a semiconductor device Jens Hofrichter, Manuel Kaschowitz, Bernhard Poelzl, Karl Rohracher, Amandine Jouve +3 more 2025-06-03
12227679 Surface activated bonding method by ion or atom bombardment of a first surface of a first substrate to a second surface of a second substrate Karine ABADIE, Quentin Lomonaco 2025-02-18