Issued Patents 2025
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431456 | Package structure including a first non-conductive layer having a greater melt viscosity than a second non-conductive layer and method for fabricating the package structure | — | 2025-09-30 |
| 12424505 | Wafer warpage adjustment structure and method for manufacturing the same | — | 2025-09-23 |
| 12426280 | Semiconductor structure with increased number of stacked memory dies and method of manufacturing the same | Kaimin LV | 2025-09-23 |
| 12374634 | Chip structure and semiconductor structure comprising auxiliary bonding region above guard ring structure | — | 2025-07-29 |
| 12347765 | Semiconductor structure and method for fabricating same | — | 2025-07-01 |
| 12261137 | Bonding structure and method for forming the same | — | 2025-03-25 |
| 12211813 | Semiconductor structure and manufacturing method thereof | — | 2025-01-28 |