Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417997 | Wire bonding apparatus, method for manufacture of semiconductor device, and semiconductor device | Shinsuke Tei | 2025-09-16 |
| 12374563 | Semiconductor device manufacturing method | Shinsuke Tei | 2025-07-29 |