Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381170 | Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding | Chia-Hsin Lee, Arthur O. Southard, Chen-Yu Wu, Xiao Liu | 2025-08-05 |