Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381111 | Wafer bonding method and bonded wafer | Chao Wang, Youdong Jiang, Zhiyong Suo | 2025-08-05 |
| 12199017 | Semiconductor device and method for manufacturing the same | Xiaoyan Zhang, Jiawei Wen, Jinhan Zhang, Ronghui Hao, Xingjun Li +1 more | 2025-01-14 |