Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12396091 | Component carrier with a via containing a hardened filling material | ShuYing Yao, Jens Riedler, Vanesa López Blanco | 2025-08-19 |
| 12232263 | Component carriers connected by staggered interconnect elements | Jens Riedler, Christopher D. Hermann | 2025-02-18 |
| 12219701 | Component carrier | Reinhard Opitz | 2025-02-04 |