Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12245383 | Method of preparing a high density interconnect printed circuit board including microvias filled with copper | Bert Reents, Akif Özkök, Soungsoo Kim, Horst Brüggmann, Herwig Josef BERTHOLD +2 more | 2025-03-04 |