Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412810 | Single side via fill process for through-vias | Jon Thomas WOODYARD | 2025-09-09 |
| 12404597 | Electrochemical depositions of nanotwin copper materials | Jing Xu, John L. Klocke, Eric J. Bergman, Kwan Wook Roh | 2025-09-02 |