Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394731 | Compression structures for IC packages | Helia Rahmani, Stephane J. Marcadet, Scott J. Campbell, Zhiyong Xia, Stephen V. Jayanathan +1 more | 2025-08-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394731 | Compression structures for IC packages | Helia Rahmani, Stephane J. Marcadet, Scott J. Campbell, Zhiyong Xia, Stephen V. Jayanathan +1 more | 2025-08-19 |