Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362230 | Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device | Thomas Bodner | 2025-07-15 |
| 12211769 | Through-substrate via and method for manufacturing a through-substrate via | Jochen Kraft, Stefan Jessenig | 2025-01-28 |