Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388032 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Ji Young Chung, Choon Heung Lee | 2025-08-12 |
| 12362343 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2025-07-15 |
| 12211705 | Stiffener package and method of fabricating stiffener package | Jin Young Kim, Seung Jae Lee | 2025-01-28 |