Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388005 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park | 2025-08-12 |
| 12374558 | Laser-assisted bonding apparatus for bonding an electronic device to a substrate | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim | 2025-07-29 |