Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388018 | Device chip scale package including a protective layer and method of manufacturing a device chip scale package | Jae Beom Shim, Seung Nam Son, Won Chul Do | 2025-08-12 |
| 12278196 | Semiconductor devices and methods of manufacturing semiconductor devices | Jae Beom Shim, Min Jae Yi, Yi Seul Han, Young Ju Lee, Kyeong Tae Kim | 2025-04-15 |