Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327806 | Semiconductor die with peculiar bond pad arrangement for leveraging mutual inductance between bond wires to realize bond wire T-coil circuit with equivalent negative inductance | Ming-Yin Ko, Chun-Wei Chen | 2025-06-10 |
| 12201996 | Purifying device | Zhentao Hu, Yaozhen Lu, Xuedan Hou | 2025-01-21 |