Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300621 | Hybrid integrated circuit package | Jiaming Zhang | 2025-05-13 |
| 12218031 | Thermal interface material containment | Gannon Reichert, Vinh T. Nguyen | 2025-02-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300621 | Hybrid integrated circuit package | Jiaming Zhang | 2025-05-13 |
| 12218031 | Thermal interface material containment | Gannon Reichert, Vinh T. Nguyen | 2025-02-04 |