Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272687 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2025-04-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272687 | Semiconductor device package with conductive pillars and reinforcing and encapsulating layers | Yuan-Feng Chiang | 2025-04-08 |