Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322690 | Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technology | Wen-Hsien Huang | 2025-06-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322690 | Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technology | Wen-Hsien Huang | 2025-06-03 |