Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12060264 | SOC PMUT suitable for high-density system integration, array chip, and manufacturing method thereof | Hui Li | 2024-08-13 |
| 11952222 | Material conveying device, processing equipment facilitating material distribution and material distribution method | Dongsheng Qu, Changfeng Li, Junsheng Xia, Jian Yang, Hongjun Wu +5 more | 2024-04-09 |