Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12112115 | Routing structure and method of wafer substrate with standard integration zone for integration on-wafer | Shunbin Li, Weihao Wang, Ruyun Zhang, Qinrang Liu, Jianliang Shen | 2024-10-08 |
| 11983481 | Software-defined wafer-level switching system design method and apparatus | Shunbin Li, Ruyun Zhang, Weihao Wang, Qingwen Deng | 2024-05-14 |
| 11887964 | Wafer-level heterogeneous dies integration structure and method | Shunbin Li, Weihao Wang, Ruyun Zhang, Qinrang Liu, Jianliang Shen | 2024-01-30 |
| 11876071 | System-on-wafer structure and fabrication method | Weihao Wang, Shunbin Li, Guandong Liu, Ruyun Zhang, Qinrang Liu +1 more | 2024-01-16 |