Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183818 | Power semiconductor device and manufacturing method therefor | Weifeng Sun, Rongcheng Lou, Kui Xiao, Jiaxing Wei, Sheng-Hua Li +3 more | 2024-12-31 |
| 12172348 | Compression molding die for I-shaped part | Wenguang Yang, Keyuan Sun, Peimin Chen, Yu Jin, Zhaoxi Chen +3 more | 2024-12-24 |