Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185550 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2024-12-31 |
| 12137567 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Yongna Li, Feng Pan, Steve Weiyi Yang | 2024-11-05 |
| 12137568 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2024-11-05 |
| 11956953 | Joint opening structures of three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Guanping Wu, Feng Pan, Xianjin Wan, Baoyou Chen | 2024-04-09 |